• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:NL1039519A
    申请号:NL1039519
    申请日:2012-04-04
    公开日:2012-10-16
    发明作者:Gerd Jaeger
    申请人:Sios Messtechnik Gmbh；
    IPC主号:
    专利说明:

    Sensor for the tactile measurement of forces and moments
    The invention relates to a sensor for the tactile measurement of forces and / or moments and / or deformations, comprising a sensing element, parallel spring assemblies which are formed from a few springs of silicon, which are connected via spacers, and with piezo-resistive resistors , which are connected in a full Wheatstone bridge.
    Force moment sensors are known in the state of the art, which consist of metallic deformation bodies with metal stretch strips glued thereto. Such a sensor is described, for example, in Kempe: Sensortechnik für Industrieroboter der 2. und 3. Generation, msr 26 (1983), pp. 12-18.
    Furthermore, devices for the measurement of three forces are known. Metallic deformation bodies with metal stretch strips glued thereto are also used in these devices.
    Also with a device for the three-dimensional force measurement described in DE 43 09 082 A1, metallic deformation bodies with strain gauges glued thereto are used.
    A further device for the measurement of forces and torques is described in DD 260 851 A3. In this publication, metallic deformation bodies are combined in such a way that three moments and three forces can be measured. Apparently metallic strain gauges are glued for this at suitable points. This is a complicated mechanical assembly with all the drawbacks which metallic deformation bodies have with metallic strain gauges glued on.
    The strain gauges glued to metallic bodies have the disadvantages that the K-factors of the strain gauges are very small and therefore the measurement sensitivity is low and that the gluing points are unstable.
    The publication: S. Bütefisch et al: Mikrotaster für die Anwendung in der taktilen Wegmesstechnik, in: tm - Technisches Messen 05/2003, pp. 238-243, describes a piezo-resistive microtaster, with piezo-resistive resistances on a silicon membrane up to bridges are connected. The diaphragm is connected with a touch pen for touching the measurement objects.
    Although with the piezo-resistive resistors integrated in the silicon, enormous progress is achieved in comparison with strain gauges glued on it, which is characterized by very high K-factors and therefore high measuring sensitivity, the following drawbacks still exist: 1. The rigidity in the measuring directions are different.
    2. Significant measurement errors occur when the stylus is deformed.
    3. The attachment of the touch probe and the influence of the length of the touch probe cause measurement errors.
    DE 10 2008 037 926 B3 describes a device for the tactile measurement of three-dimensional forces, which overcomes the disadvantages of the aforementioned devices. In this device, directly above the sensing element, two 90 'displaced parallel spring assemblies of silicon with integrated piezo-resistive resistors, which are always connected in a full Wheatstone bridge, are present. With this, forces and deformations in the x and y directions can be measured. At the end of the second parallel spring assembly of silicon, an Si probe can be provided, whose deflection, however, has no influence on the measurement of the x and y forces. For the measurement of the forces and deformations in the z direction, a parallel spring assembly of silicon, again with integrated piezo-resistive resistors, is arranged transversely to the stylus.
    The essential advantages of this device are: high K factors the parallel springs of silicon can be dimensioned such that the stiffnesses in the x, y and z directions are equal.
    the length of the stylus has no influence.
    A lack of the state of the art of measuring transducers of silicon with integrated piezo-resistive resistors consists in that only forces can be measured and not even more moments.
    The object of the invention is therefore to create a sensor which makes it possible to measure three forces and three moments as well as the measurement of distortions.
    According to the invention, the object is solved by a sensor which has the features indicated in claim 1.
    Advantageous embodiments of the invention are the subject of the dependent claims.
    The sensor according to the invention for the tactile measurement of three forces and three moments as well as for the measurement of deformations comprises a sensor element and parallel spring assemblies of silicon with piezo-resistive resistors, which are connected in a full Wheatstone bridge. Above the sensing element are two silicon spring assemblies that are offset by 90 ° relative to each other and each have four piezo-resistive resistors. The parallel spring assemblies of silicon are connected by means of silicon spacers and a holder element of silicon. Perpendicular to this silicon parallel spring assembly, a further four silicon bead springs with piezo-resistive resistors are attached. To this end, four additional silicon parallel springs with piezo-resistive resistors are arranged perpendicularly above these four silicon parallel springs. All silicon parallel springs are connected to additional silicon holding elements. The four additional silicon parallel springs are attached at their ends facing the center to a silicon holding element which is simultaneously connected to the frame.
    The spacers and the holder elements can also consist of invar or glass instead of silicon.
    The sensor makes it possible to measure three forces and three moments with high precision. The silicon parallel springs can be dimensioned in a simple manner such that both the spring stiffnesses of the components for the measurement of the three forces perpendicular to each other and the moments of resistance of the components for the measurement of the three perpendicular to each other moments are equal.
    A further advantage of the invention is that the piezo-resistive resistors have a K-factor (sensitivity factor) of about 80 and are integrated into the silicon by doping. Therefore, the disadvantages that occur with strain gauges glued onto it are eliminated, which moreover have only a K-factor of about 2.
    A further advantage of the sensor is that the length of the probe has no influence on the deflection of the silicon parallel spring assemblies of silicon.
    Embodiments of the invention are explained in more detail below with reference to drawings. Show in it:
    Figure 1 is a perspective representation of the force-moment sensor,
    Figure 2 is a top view of the force moment sensor,
    Figure 3 shows a longitudinal section A-A through the force-moments sensor and
    Figure 4 shows a section B-B for the representation of a holder element of silicon and the parallel spring assembly of silicon.
    Corresponding components are provided with the same reference marks in all figures.
    The force moment sensor 1 shown in Figure 1 for the tactile measurement of the forces Fx, Fy / Fz, the moments Mx, My, Mz and for the measurement of the deformations comprises a sensing element 12; the spacer elements of silicon 10, 11; the holder elements of silicon 2, 3; assemble the parallel spring of silicon 4.1, 4.2, 4.3, 4.4, 5.1, 5.2, 5.3, 5.4, 6, 7 and the piezo-resistive resistors 8.
    The parallel spring assemblies of silicon 4.1, 4.2, 4.3, 4.4, 5.1, 5.2, 5.4, 6 and 7 are formed from silicon leaf spring elements arranged in parallel with each other, each parallel spring assembly of silicon having at least one silicon leaf spring element with four in contains a full bridge of Wheatstone connected piezoresistive resistors 8.
    The forces Fx, Fy, Fz and moments Mx, My, Mz engaging the sensing element 12 can be measured with the proposed force-moment sensor, wherein the parallel spring assemblies of silicon can be dimensioned such that the spring stances for the measurement of the forces and the moments of resistance for the measurement of the moments are equal.
    Assembling the parallel spring of silicon 4.1, 4.2, 4.3, 4.4 are retained by means of the sub-holder elements of silicon 3.1, 3.2, 3.3, 3.4 and the third holder element of silicon 2 arranged on the second holder element of silicon 3. The parallel spring assemblies of silicon 5.1, 5.2, 5.3, 5.4 are attached by means of the second holder element of silicon 3 and the first holder element of silicon 9. The second parallel spring assembly of silicon 7 is held by means of the first holder element of silicon 9 and the first spacer element of silicon 10 as shown in Figure 3. The attachment of the first parallel spring assembly of silicon 6 takes place by means of the first spacer element of silicon 10 and the second spacer element of silicon 11.
    Instead of silicon, the spacer elements 10, 11 as well as the holder elements 2, 3 and 9 can also consist of invar or glass.
    The force effects in the x-direction can be measured with the aid of the parallel spring assembly of silicon 6 and the force effects in the y-direction with the aid of the parallel spring assembly of silicon 7. As shown in Figures 1 and 3, the forces in z direction can be determined by means of the parallel spring assembling of silicon 5.1, 5.2, 5.3, 5.4.
    The moment Mx is determined by the parallel spring assembling of silicon 5.1 and 5.4 and the moment My by means of parallel spring assembling of silicon 5.2 and 5.3. The parallel spring assemblies of silicon 5.1, 5.2, 5.3, 5.4 are also visible from Figure 2. The operation of the parallel spring assemblies of silicon 5.2 and 5.3 is also shown in figure 3.
    The moment Mz is measured using the parallel spring assemblies of silicon 4.1, 4.2, 4.3 and 4.5.
    These assemblies are shown in Figures 1 and 2. Figure 3 shows the parallel spring assemblies of silicon 4.3 and 4.4.
    Figure 2 shows the plan view of the force-moment sensor 1 shown in Figure 1. Assembling the parallel spring of silicon 4.1, 4.2, 4.3 and 4.4. are attached to the part holder elements of silicon 3.1, 3.2, 3.3. and 3.4 as well as attached to the silicon 2 holding element. The parallel spring assemblies of silicon 5.1, 5.2, 5.3 and 5.4 are held on the holder element of silicon 3 and as shown in Figure 3 on the first holder element of silicon 9.
    Figure 3 shows the section A-A through the assembly shown in Figure 2. It has been proposed to assemble the parallel spring of silicon 4.3, 4.4., 5.2, 5.3, 6, the holder elements 2, 3, 9 as well as the spacer elements of silicon 10 and 11. The force moment sensor 1 is made of silicon by means of the third holder element 2 attached to the frame 13.
    Figure 4 shows the section BB by figure 3 and shows the second holder element of silicon 3 with the cut-through part holder elements of silicon 3.1, 3.2, 3.3, 3.4 as well as the attachment of the parallel spring assemblies of silicon 5.1, 5.2, 5.3 and 5.4 to the second holder element 3.
    List of reference marks 1 Sensor 2 third holder element 3 second holder element 3.1 first part holder element 3.2 second part holder element 3.3 third part holder element 3.4 fourth part holder element 4.1 third parallel spring assembly 4.2 fourth parallel spring assembly 4.3 fifth parallel spring assembly 4.4 sixth parallel spring assembly 5.1 seventh parallel spring assembly 5.2 eighth parallel spring assembly 5.3 ninth parallel spring assembly assembly 5.4 tenth parallel spring assembly 6 first parallel spring assembly 7 second parallel spring assembly 8 piezo-resistive resistors 9 first holder element 10 first spacer element 11 second spacer element 12 sensing element 13 frame
    Fv force in x direction
    Fy force in y direction
    Fz force in z direction
    Mx moment around x-axis
    My moment around y-axis M2 moment around z-axis
    权利要求:
    Claims (4)
    [1]
    Sensor (1) for tactile measurement of forces, moments and deformations, comprising a sensing element (12), parallel spring assemblies (4, 5), which are formed from single silicon springs connected via spacers and with piezo -resistive resistors (8), which are connected in a full Wheatstone bridge, characterized in that a first and a second parallel spring assembly (6, 7) are displaced by 90 ° relative to each other in series in the series arranged that the single silicon springs of the first and the second parallel spring assembly (6, 7) are spaced by means of spacer elements (10, 11) and a first holder element (9), which further four parallel spring assemblies (5.1 , 5.2, 5.3, 5.4) form a cross and are arranged perpendicular to the first and second parallel spring assembly (6, 7), which assemble the single silicon springs of the further parallel spring (5.1, 5.2, 5.3, 5.4) by the first holder element (9) as well as by a second holder element (3) are spaced apart, which assemble four additional parallel springs (4.1, 4.2, 4.3, 4.4), which also form a cross and assemble rectangularly with respect to the further four parallel springs (5.1, 5.2, 5.3, 5.4), the additional four parallel springs are assembled (4.1, 4.2, 4.3, 4.4.) By four sub-holder elements (3.1, 3.2, 3.3, 3.4), which are mounted on the second holder element (3) and by a central third holder element (2) is formed, each of which comprises a single silicon spring of the parallel spring (4.1, 4.2, 4.3, 4.4, 5.1, 5.2, 5.3, 5.4, 6) and four piezo-resistive resistors (8) and in that the sensor (1) is held on the frame (13) by means of the central third holder element (2).
    [2]
    Sensor according to claim 1, characterized in that the spacers (10, 11) and the holder elements (2, 3, 9) consist of silicon.
    [3]
    Sensor according to claim 1, characterized in that the spacers (10, 11) and the holder elements (2, 3, 9) consist of invar.
    [4]
    Sensor according to claim 1, characterized in that the spacers (10, 11) and the holder elements (2, 3, 9) consist of glass.
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    同族专利:
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    NL1039519C2|2013-09-03|
    DE102011007350B4|2013-04-11|
    DE102011007350A1|2012-10-18|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DD260851A3|1986-09-04|1988-10-12|Ilmenau Tech Hochschule|DEVICE FOR MEASURING VEHICLES AND TORQUE|
    DE102008037926B3|2008-08-14|2010-02-04|SIOS Meßtechnik GmbH|Device for tactile measurement of three-dimensional forces, has touch element, tracer pin and parallel spring-elements with strain sensors, where parallel spring-element is arranged transverse to tracer pin|
    JPH0614011A|1992-06-25|1994-01-21|Matsushita Electric Works Ltd|Diversity reception antenna switching system|
    DE4309082A1|1993-03-20|1994-09-22|Pietzsch Automatisierungstech|Measuring device for measuring the shape of cylinders|DE102012219203B3|2012-10-22|2013-11-14|SIOS Meßtechnik GmbH|Device for force- or displacement measurement, has two meander arrangements connected to each other by coupling piece to form parallel spring arrangement, where each meander arrangement has neutral silicon springs and active silicon springs|
    DE102014219280B3|2014-09-24|2015-11-26|SIOS Meßtechnik GmbH|Device for positioning and measuring of measuring objects|
    JP6586860B2|2015-02-25|2019-10-09|日本精工株式会社|Force sensor|
    CN111854662B|2020-07-16|2021-05-28|西安交通大学|Single-piezoelectric parallel synchronous driving variable-stiffness measuring head|
    法律状态:
    2019-12-04| MM| Lapsed because of non-payment of the annual fee|Effective date: 20190501 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE102011007350|2011-04-14|
    DE102011007350A|DE102011007350B4|2011-04-14|2011-04-14|Sensor for the tactile measurement of forces and moments|
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